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Semiconductor Front-End Patterned Wafer Defect Inspection System (Spark 100)
Front-end patterned wafer defect inspection systems are core tools in chip manufacturing, widely used for rapid inspection and classification of surface pattern defects after front-end processes such as lithography, etching, and polishing.
The SPARK100 series integrates high-resolution optical imaging, advanced image processing, and AI-based defect classification. Its key performance metrics, including detection sensitivity and throughput, are comparable to those of internationally available systems in the same class.
The system supports multiple operating modes. Combined with a high-intensity pulsed illumination system and precision motion control, it enables high-speed, high-quality image acquisition and processing at different sensitivity levels. In terms of standardization and interfaces, the system complies with SEMI standards and provides a standard EAP interface, supporting AMHS automation systems (AGV/OHT) to meet flexible production requirements.
System Features/Advantages
The system supports multiple operating modes to meet customized customer requirements.
Inspection Modes:Black-and-white/color channel switching or combination
Reinspection Modes:Black-and-white/color channel switching or combination
Objective Options:2×/5×/10×/20×/50× (optional)
Bright-Field Modes:White, red, green, and blue selectable
Dark-Field Modes:Configurable based on application requirements
Polarization Mode/3D Enhancement Mode/Auto Focus
Mapping:Supports multiple map formats and is compatible with SECS/GEM interfaces
0.25 μm high resolution with inspection repeatability up to 99%
Application Scenarios
Front-end wafer macro defect inspection
 ADI |
 AEI |
 API |
 OQA |
