Semiconductor Display

Integrated circuit

High end equipment metal Process Solutions

(1)Automation--Meets industrial automation requirements for measurement and inspection
Software Automation:
Auto Probe Exchange:
High-precision probe positioning platform with magnetic tip-hold technology, enabling one-click automatic probe exchange with a success rate greater than 95%.
Auto Measurement:
Automatically retrieves sample from Foup, aligns it, measures, processes data, saves results, and returns the sample to the Foup.
Algorithm Automation:
Smart Tip Positioning:
High-precision motion control algorithms ensure fast and precise probe positioning.
Automated Data Analysis:
AI-assisted algorithms automatically identify surface features, supporting batch data processing and statistical analysis.
Customizable analysis templates enable one-click defect classification, data calculation, and report generation.
(2)High Resolution--Meets high-precision mearurement requirements
Closed-loop Position Control:
XY-axis noise as low as 0.2 nm, ensuring high precision and stability during scanning.
System Base Noise:
< 40 fpm, capable of capturing the smallest surface feature variations.
(3)Multi-functionality--Adapts to a wide range of application scenarios
Includes multiple scanning modes, adaptable for various applications.
(4)Large Travel Range--Die-level Imaging:
High-speed ADC/DAC feedback control
External Motion Control: Centimeter-level sample scanning with external motion control precision < ±10 nm at 10 mm and < ±2 nm at 1 mm.
Sample Stage: 300mm * 300mm * 30mm XYZ stage, compatible with 200mm/300mm wafers, with repeat positioning accuracy of < 0.5 µm.

