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OLED Display Panel Submicron Crack Inspection (GDS1, GDS4, GDSH）
The inspection and metrology equipment platform has developed a customized AOI system for the OLED field, designed to detect micron-level defects such as cracks and rainbow patterns in display device hole regions as well as inner- and outer-arc edge areas.
The system is primarily used for defect inspection of OLED display modules at the post-lamination stage of 2.5D and 3D panels, targeting inner-arc and outer-arc edge cracks in hyperbolic and quad-curved structures, as well as cracks, bubbles, and rainbow patterns in hole regions.
With a minimum detectable defect size of 0.5 μm, the system supports 2D, 2.5D, 3D, and foldable products, achieving a false detection rate below 0.5% and a miss detection rate below 0.01%.
The system is primarily used for defect inspection of OLED display modules at the post-lamination stage of 2.5D and 3D panels, targeting inner-arc and outer-arc edge cracks in hyperbolic and quad-curved structures, as well as cracks, bubbles, and rainbow patterns in hole regions.
With a minimum detectable defect size of 0.5 μm, the system supports 2D, 2.5D, 3D, and foldable products, achieving a false detection rate below 0.5% and a miss detection rate below 0.01%.
Application Scenario: AOI for Micron-Level Crack Inspection in OLED Display Device Edge Regions
Process Stage: EAC / Module
Core Technologies:High-Precision AOI, Deep Learning–Based Defect Detection Algorithms, High-Speed Line-Scan Imaging and Precision Motion Control, Bright-Field and Dark-Field Multispectral Imaging, Microscopy Enhancement Technologies
Inspection Item:Crack
Process Flow:Tray / Stage Loading → Pre-Alignment → Fine Alignment → Short-Edge Inspection → Long-Edge Inspection → OK / NG Unloading
