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Inspection System
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High end equipment metal Process Solutions
Semiconductor TGV Advanced Packaging Defect Inspection System (Spark 120)
This system is designed for board-level TGV advanced packaging lines, integrating high-resolution imaging, advanced image processing, and AI-based defect classification for fast inspection of surface defects in processes like drilling, corrosion, developing, and etching.
System Features/Advantages
Technical Advantages：
Inspects all process stages, including incoming material, induction, etching and drilling, and metal deposition.
100% Hole Detection; Simultaneous fast detection of front, back, and sidewall holes, with a WPH of up to 20 wafers (510mm × 515mm).
Compatible with both square and round wafers; includes sidewall alignment and fluorescence PL residual adhesive testing to meet diverse needs.
defect detection.
Detects defects such as hole clogging and foreign particles inside holes, in addition to standard.
Leading algorithms provide fast and accurate measurement results and defect classification.
Application Scenarios
Fast inspection and classification of surface defects in processes such as drilling, corrosion, developing, and etching of glass substrates in TGV applications.
