Semiconductor Display

Integrated circuit

High end equipment metal Process Solutions

The system achieves a detection accuracy of >7 μm and supports inspection of edge cracks, breakage, burrs, scratches, corner radius (R-angle), edge cutting and grinding measurement, as well as dimensional measurement.
Application Scenario:①The system is designed for inspection of glass substrates during LCD/OLED large-panel manufacturing. It can be deployed at the infeed and outfeed positions of equipment across various process stages, including Array, CF, BP, TSP, EVEN, and EAC, to prevent edge-related defects such as chipping and cracks on glass substrates.
②Automated optical inspection of micron-level defects such as cracks, chipping, and burrs in the cutting edge region of the display panel after the Cell stage Cut process.
Process Stage:Array / CF / BP / TSP / EVEN / EAC / Cell Cut
Core Technologies:High-Speed Line-Scan Imaging, Modular High-Intensity Lighting, Industrial AI Algorithms
Inspection Item:Crack, Burr, Chipping, Breakage
Process Flow:Material Loading → Code Reading & Alignment → Edge Inspection → Buffering → Unloading

