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LCD/OLED Edge Glass Inspection System
The inspection and metrology equipment platform targets the LCD and OLED field, supporting edge appearance inspection and metrology of glass substrates across the BP, Array, Cell, and Module stages.
The system achieves a detection accuracy of >7 μm and supports inspection of edge cracks, breakage, burrs, scratches, corner radius (R-angle), edge cutting and grinding measurement, as well as dimensional measurement.

Application Scenario:①The system is designed for inspection of glass substrates during LCD/OLED large-panel manufacturing. It can be deployed at the infeed and outfeed positions of equipment across various process stages, including Array, CF, BP, TSP, EVEN, and EAC, to prevent edge-related defects such as chipping and cracks on glass substrates.

②Automated optical inspection of micron-level defects such as cracks, chipping, and burrs in the cutting edge region of the display panel after the Cell stage Cut process.

Process Stage:Array / CF / BP / TSP / EVEN / EAC / Cell Cut

Core Technologies:High-Speed Line-Scan Imaging, Modular High-Intensity Lighting, Industrial AI Algorithms

Inspection Item:Crack, Burr, Chipping, Breakage

Process Flow:Material Loading → Code Reading & Alignment → Edge Inspection → Buffering → Unloading