The system supports OC appearance, post-bonding, and OLED module appearance inspections.

The system supports automatic substrate handling, alignment, PCB and COF inspection, and UV adhesive inspection, detecting defects such as chipping, missing corners, protective film, polarizer, and COF/PCB failures.

Inspection Cycle Time: ≤14 s

Product Size: 1–12 inches / 32–86 inches

Miss Detection Rate: ≤0.05%

False Detection Rate: ≤10%