Home
>
Integrated circuit
>
Inspection System
Semiconductor Display
Integrated circuit
High end equipment metal Process Solutions
Semiconductor Advanced Packaging 3D AOI Inspection System (Spark 110)
Bump bonding uses conductive bumps to achieve die-to-die and die-to-wafer electrical interconnection. It is a key enabling technology for 2.5D and 3D advanced packaging, and remains essential for future 3.5D and 4D packaging.
The system detects bump misalignment, missing bumps, bridging, and height inconsistencies. With bump diameter and spacing shrinking, up to 50 million bumps can be placed on a 12-inch wafer, making high-speed, high-precision bump defect inspection essential for yield control in advanced packaging. It integrates high-precision line-confocal and white-light triangulation 3D inspection modules, along with a high-speed data acquisition and processing system, achieving defect sensitivity and throughput comparable to international systems in the same class.
