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Semiconductor Display
Integrated circuit
High end equipment metal Process Solutions
Semiconductor Metrology Customized Integrated System (Spark 130)
System Features/Advantages
Multi-Process Stage Coverage:Covers multiple process stages including substrate, lithography, etching, dicing, and packaging.
High Compatibility for Various Sample Sizes and Shapes:Supports wafers from 1.5" to 12", square substrates from 20mm to 100mm, and over 10 different product specifications.
High Integration in One System:Integrates 2D AOI, 3D AOI, CD measurement, and OVL measurement functions into a single system.
High Precision:2D AOI detection accuracy of 1 µm, and 3D AOI can detect bump diameters as small as 6 µm.
